Semiconductor substrate jig and method of manufacturing a semiconductor device

ABSTRACT

The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame  21,  and a rubber film  22  arranged within the outer frame  21  and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film  22  increases, the wafer-fixing jig  20  deforms the rubber film and allows the tapes  2  and  6  arranged between the wafer  1  and the rubber film  22 A to be pushed toward the wafer  1  gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

BACKGROUND OF THE INVENTION

[0001] This application claims the benefit of a Japanese PatentApplication No. 2001-322811 filed Oct. 19, 2001 in the Japanese PatentOffice, the disclosure of which is hereby incorporated by reference.

[0002] 1. Field of the Invention

[0003] The present invention generally relates to jigs for semiconductorsubstrates and methods for manufacturing semiconductor devices using thesame, and more particularly to a method of manufacturing a semiconductordevice including a step of back grinding the back surface of thesemiconductor substrate (wafer), a step of dicing for singularizing intosemiconductor elements, and a step of bonding including picking up suchsingularized semiconductor elements and mounting them to the mountingdevice; as well as to a jig for semiconductor devices used for such amethod.

[0004] Recently, with the necessity for semiconductor packages to belight, thin, short and small, the related wafers are also becomingthinner.

[0005] In each step such as in the back grind step, when the thicknessof the wafer is less than 100 μm, the wafer transportation and thesemiconductor manufacturing process are technically very difficult usingconventional methods. For this reason, a method of securely transportingand performing the process of semiconductor manufacturing with thinnerwafers is desired.

[0006] 2. Description of the Related Art

[0007] Conventionally, in manufacturing steps consisting of backgrinding the semiconductor substrate (hereinafter also referred to asthe wafer), singularizing the wafer into semiconductor elements bydicing, and bonding the singularized semiconductor elements on, forexample, the mounting substrate, the transportation and thepredetermined processes are carried out with the wafer attached to atape. Each manufacturing step is described with reference to FIG. 1.

[0008] First, as shown in FIG.1A, a circuit-forming surface is attachedto a protection tape 2(attachment step). Subsequently, as shown in FIG.1B, the wafer 1 is installed to a chuck table 4 and the back surface ofthe wafer 1 is back grounded by a rotating grind whetstone 3(back grindstep). As a result, the wafer 1 is thinned.

[0009] Secondly, a die attach film (not shown) is attached to the backsurface of the thinned wafer 1(die attach mount step).

[0010] Subsequently, as shown in FIG. 1C, as the protection tape 2attached to the wafer 1 is peeled, the back surface of the wafer 1 isattached to a dicing tape 6(tape reapplication step). The dicing tape 6is previously arranged in a frame 5 having a shape of a frame.

[0011] Next, as shown in FIG. 1D, the wafer 1 is cut along thepredetermined dicing line using a dicing saw 7, and the wafer issingularized into semiconductor elements 10 (singularization step).

[0012] The singularized semiconductor elements 10 are pressed on theirback surfaces through the dicing tape 6 using a push up pin 11 and as aresult, the semiconductor elements 10 are peeled from the dicing tape 6,as shown in FIG. 1E. A collet 8 is located opposite the push up pin 11on the upper side, and the peeled semiconductor elements 10 are adsorbedto and held by the collet 8(pick up step).

[0013] The semiconductor elements 10 held by the collet 8 aretransferred to the mounting substrate 9 as the collet 8 moves, and arebonded to the predetermined position on the mounting substrate 9 by thedie attach film (bonding step). Through these steps, the semiconductorelements 10 formed on the wafer 1 are thinned and singularized, and thenmounted on the mounting substrate 9.

[0014] The wafer 1 made extremely thin by the back grind step warps,which was not a problem with a conventional thickness. The thinning ofthe wafer 1 is not only the direct cause of reduction in the absolutestrength of the wafer. When the wafer 1 warps, the performance of eachmanufacturing step after the back grind step is degraded, and along withtransportation of the wafer becomes a factor of breakage failure.

[0015] This is significant particularly in the tape reapplication step.In other words, during the tape application, bubbles are likely to enterbetween the wafer 1 and the dicing tape 6 if the wafer 1 is thin.

[0016] When bubbles enter, the wafer 1 and the dicing tape 6 do notadhere at the locations where bubbles exist, and thus the adhesivestrength between the wafer 1 and the dicing tape 6 decreases.Furthermore, when heat is applied, the bubbles expand and the wafer 1and the dicing tape 6 are further separated from each other. Therefore,when bubbles enter, there is a possibility that an appropriate processmay not be successfully performed in the steps subsequently conducted(for example, the singularization step), and the yield of thesemiconductor manufacturing process is lowered, and in the worst case,the wafer 1 may break due to the expansion of bubbles.

[0017] On the other hand, in considering peeling the protection tape,the wafer 1 may break when the protection tape 2 is being peeled, or thewafer 1 may be peeled from the periphery at the start of peeling, andthen break.

SUMMARY OF THE INVENTION

[0018] In view of the above problems, the general object of the presentinvention is to provide a jig for holding the semiconductor substrate sothat there is little effect from thinned semiconductor substrates, andfor suppressing the occurrence of damage caused by lack of semiconductorsubstrate strength; and to provide a method of manufacturing asemiconductor device using the jig.

[0019] The above object of the present invention is achieved by thefollowing measures of the present invention.

[0020] The object of the present invention is achieved by a method ofmanufacturing a semiconductor device using a semiconductor substratejig, wherein a method comprises the steps of fixing a semiconductorsubstrate flatly to a semiconductor substrate jig so as to prevent warpsfrom occurring in the semiconductor substrate; and dicing thesemiconductor substrate into a plurality of semiconductor elements whilefixed to the semiconductor substrate jig.

[0021] According to this invention, since the semiconductor substrate isfixed to the semiconductor substrate jig without warps, the dicing stepof the semiconductor substrate can be carried out smoothly.

[0022] The object of the present invention is further achieved by amethod of manufacturing a semiconductor device using a semiconductorsubstrate jig comprising the steps of fixing a semiconductor substrateflatly to the semiconductor substrate jig so as to prevent warps fromoccurring in the semiconductor substrate; and back grinding thesemiconductor substrate while attached to the semiconductor substratejig.

[0023] According to this invention, since the semiconductor substrate isfixed to the semiconductor substrate jig without warps, the back grindstep of the semiconductor substrate can be carried out smoothly.

[0024] The object of the present invention is achieved by asemiconductor substrate jig used for arranging a film on a semiconductorsubstrate, wherein the jig has a frame, an expandable member arrangedwithin the frame and increasing or decreasing volume while deforming ashape by being supplied with fluid therein; and the shape is deformed sothat the film arranged between the semiconductor substrate and theexpandable member presses against the semiconductor substrate ascontacting portion of the expandable member to the film is enlargedoutwardly from the center of the film as the volume increases.

[0025] According to the present invention, when the volume of theexpandable member increases, the film arranged between the semiconductorsubstrate and the expandable member deforms so as to be gradually pushedtoward the semiconductor substrate from the center outward, and thus theair (bubbles) between the semiconductor substrate and the film is pushedoutward from by the center outward as the expandable member deforms.

[0026] Therefore, the bubbles are prevented from remaining between thesemiconductor substrate and the film, and the subsequent manufacturingsteps are conducted smoothly and thus the breakage failure of thesemiconductor substrate caused by the bubbles is prevented.

[0027] The above object of the present invention is also achieved by amethod of manufacturing a semiconductor device using a semiconductorsubstrate jig described above, wherein the method has steps of:

[0028] attaching a circuit-forming surface of the semiconductorsubstrate to the semiconductor substrate jig using a first adhesive tapeas the film;

[0029] back grinding a back surface of the semiconductor substrate whileattached to the semiconductor substrate jig;

[0030] reapplying and fixing the semiconductor substrate to a secondsemiconductor substrate jig so as to expose the circuit-forming surface;

[0031] singularizing the semiconductor substrate fixed on the secondsemiconductor substrate jig into a plurality of semiconductor elementsby dicing; and

[0032] picking up each of the singularized semiconductor elements fromthe second semiconductor substrate jig.

[0033] According to the above method of the present invention, since thesemiconductor substrate jig is used, the bubbles are prevented fromremaining between the semiconductor substrate and the first adhesivetape, and the semiconductor substrate is securely held to thesemiconductor substrate jig in the back grind step. Thus, the back grindstep is conducted smoothly.

[0034] The object of the present invention is further achieved by amethod of manufacturing a semiconductor device using a semiconductorsubstrate jig, wherein the method comprises the steps of:

[0035] attaching a circuit-forming surface of the semiconductorsubstrate to the semiconductor substrate jig using a first adhesive tapeas the film;

[0036] back grinding a back surface of the semiconductor substrate whileattached to the semiconductor substrate jig;

[0037] singularizing the back grounded semiconductor substrate fixed onthe semiconductor substrate jig into a plurality of semiconductorelements by dicing;

[0038] reapplying and fixing all of the semiconductor elements on asecond semiconductor substrate jig so as to collectively expose thecircuit-forming surface; and

[0039] picking up each of the singularized semiconductor substrates fromthe second semiconductor substrate jig.

[0040] As described above, after the back grind step is completed, thetape reapplication step may be conducted before or after performing thesingularization step.

[0041] The object of the present invention is furthermore achieved by amethod of manufacturing a semiconductor device using a semiconductorsubstrate jig described above, wherein the method comprises the stepsof:

[0042] attaching a circuit-forming surface of the semiconductorsubstrate to the semiconductor substrate jig using a first adhesive tapeas the film;

[0043] back grinding a back surface of the semiconductor substrate whileattached to the semiconductor substrate jig;

[0044] singularizing the back grounded semiconductor substrate fixed toa second semiconductor substrate jig into a plurality of semiconductorelements by dicing; and

[0045] picking up each of the singularized semiconductor elements fromthe second semiconductor substrate jig and turning the picked upsemiconductor elements upside down.

[0046] According to the above method of the present invention, since thetape reapplication step does not exist, the damage to the semiconductorsubstrate is prevented and there is no possibility of bubbles enteringbetween the semiconductor substrate and the adhesive tape at the time ofreapplication.

[0047] The object of the present invention is also achieved by a methodof manufacturing a semiconductor device using a semiconductor substratejig described above, wherein the method comprises the steps of:

[0048] attaching a circuit-forming surface of the semiconductorsubstrate to the semiconductor substrate jig using a first adhesive tapeas the film;

[0049] singularizing the semiconductor substrate fixed on thesemiconductor substrate jig into a plurality of semiconductor elementsby dicing;

[0050] back grinding collectively back surfaces of plural semiconductorelement attached to the semiconductor substrate jig;

[0051] reapplying and fixing the semiconductor elements collectively toa second semiconductor substrate jig so as to expose the circuit-formingsurface; and

[0052] picking up each of the semiconductor elements from the secondsemiconductor substrate jig.

[0053] The object of the present invention is achieved by a method ofmanufacturing a semiconductor device using a semiconductor substrate jigdescribed above, wherein the method comprises the steps of:

[0054] attaching a circuit-forming surface of the semiconductorsubstrate to the semiconductor substrate jig using a first adhesive tapeas the film;

[0055] singularizing the semiconductor substrate fixed on thesemiconductor substrate jig into a plurality of semiconductor elementsby dicing;

[0056] back grinding back surfaces of plural singularized semiconductorelements attached to the semiconductor substrate jig; and

[0057] picking up each of the singularized semiconductor elements fromthe second semiconductor substrate jig and turning the picked upsemiconductor elements upside down.

[0058] When the above method is used, by conducting the back grind stepafter the singularization step is completed, the strength of thesemiconductor element is increased. Further, because the reapplicationstep is excluded, the damage to the semiconductor element and theentering of bubbles between the semiconductor element and the adhesivetape are prevented.

[0059] The object of the present invention is achieved by asemiconductor substrate jig used for arranging a film on a semiconductorsubstrate, wherein the jig comprises:

[0060] a frame with a bottom;

[0061] a set of plural annular members arranged concentrically withinthe frame and constructed so as to be individually movable in adirection perpendicular to the semiconductor substrate, the height ofthe annular members in the direction perpendicular to the semiconductorsubstrate gradually increasing from an outer circumference toward aninner circumference;

[0062] a biasing member for biasing each of the annular members towardthe bottom of the frame; and

[0063] an operating member contacting the annular members by operatingmovement in the frame and provided for biasing in a direction separatingthe annular members from the bottom of the frame against the bias forceof the biasing member; wherein

[0064] each of the annular members moves so as to gradually presses thefilm arranged between the semiconductor substrate and the set of annularmember toward the semiconductor substrate from center outward with theoperation of the operating member.

[0065] According to the above method of the present invention, with theoperation of the operating member, each annular member is independentlymoved and gradually presses the film toward the semiconductor substratefrom the center outward. Thus, the air (bubbles) between thesemiconductor substrate and the film is pushed from the center outwardwith the movement of the annular member.

[0066] Therefore, the bubbles are prevented from existing between thesemiconductor substrate and the film, and the subsequent manufacturingsteps are smoothly conducted and the damage to the semiconductorsubstrate caused by the entering of the bubbles is prevented.

[0067] The object of the present invention is achieved by a method ofmanufacturing a semiconductor device using a semiconductor substratejig, wherein the method comprises the steps of:

[0068] attaching a circuit-forming surface of the semiconductorsubstrate to the semiconductor substrate jig using a first adhesive tapeas the film;

[0069] back grinding a back surface of the semiconductor substrate whileattached to the semiconductor substrate jig;

[0070] die attach mounting for arranging die attach material to the backsurface of the semiconductor substrate;

[0071] reapplying and fixing the semiconductor substrate on a secondsemiconductor substrate jig and exposing the circuit-forming surface;

[0072] singularizing the semiconductor substrate fixed on the secondsemiconductor substrate jig into a plurality of semiconductor elementsby dicing; and

[0073] picking up each of the singularized semiconductor elements fromthe second semiconductor substrate jig.

[0074] According to the above method of the present invention, theentering of bubbles between the semiconductor substrate and the firstadhesive tape is prevented, and the semiconductor substrate is securelyheld by the semiconductor substrate jig in the back grind step. Thus,the back grind step is conducted smoothly.

[0075] The object of the present invention is achieved by semiconductorsubstrate jig used in arranging a film to a semiconductor substrate,wherein the jig comprises:

[0076] a frame;

[0077] a porous member arranged within the frame so as to be oppositethe film; and

[0078] a vacuum hole formed in the frame and provided for applyingnegative pressure to the porous member.

[0079] With the above semiconductor substrate jig, it is possible toprevent bubbles from entering between the film and the semiconductorsubstrate because the film is adsorbed to the semiconductor substratejig through the negative pressure applied to the porous member and thusthe film is planed.

[0080] The object of the present invention is achieved by a method ofmanufacturing a semiconductor substrate comprising the steps of:

[0081] attaching a circuit-forming surface of the semiconductorsubstrate to a semiconductor substrate jig that transmits light using adouble-sided tape applied with an adhesive having ultraviolet curingproperties on both sides;

[0082] back grinding a back surface of the semiconductor substrateattached to the semiconductor substrate jig;

[0083] irradiating ultraviolet rays to adhesives having the ultravioletcuring properties through the semiconductor substrate;

[0084] reapplying for arranging die attach film to the back surface ofthe semiconductor substrate, reapplying and fixing the semiconductorsubstrate to a second semiconductor substrate jig, and then exposing thecircuit-forming surface;

[0085] singularizing the semiconductor substrate fixed on the secondsemiconductor substrate jig into a plurality of semiconductor elementsby dicing; and

[0086] picking up each of the singularized semiconductor elements fromthe second semiconductor substrate jig.

[0087] According to the above method of the present invention, as thematerial that transmits light is selected to be used as thesemiconductor substrate jig, ultraviolet rays can be irradiated to theadhesives with the properties of ultraviolet curing through thesemiconductor substrate jig in the tape reapplication step even if theback grind step is conducted with the semiconductor substrate adheringto the semiconductor substrate jig.

[0088] The object of the present invention is achieved by asemiconductor substrate jig comprising

[0089] a first jig having a first suction mechanism sucking thesemiconductor substrate; and

[0090] a second jig having a second suction mechanism sucking thesemiconductor substrate;

[0091] the first and second jigs being removably constructed andindependently sucking the semiconductor substrate.

[0092] According to the above jig of the present invention, because thefirst and the second suction mechanisms can independently suck thesemiconductor substrate, the semiconductor substrate can be mountedindependently to the first or the second jig. Thus, when the first jigand the second jig are combined, the semiconductor substrate can besuctioned using the first suction mechanism and the second suctionmechanism.

[0093] Therefore, in case suction is switched from the first suctionmechanism to the second suction mechanism, the suction of the secondsuction mechanism starts while the first suctioning mechanism is stillsuctioning, and then the suction by the first suction mechanism isreleased, thus the semiconductor substrate is constantly suctioned. Thesemiconductor substrate is prevented from warping because thesemiconductor substrate is held either by the first or the second jigeven if the semiconductor substrate is thinned.

BRIEF DESCRIPTION OF THE DRAWINGS

[0094] The description of the preferred embodiments of the presentinvention will now be explained with reference to the figures in which:

[0095] FIGS. 1A-1E are flow diagrams for explaining conventional methodof manufacturing a semiconductor device;

[0096]FIG. 2A is a top view showing a semiconductor substrate jigaccording to a first embodiment of the present invention;

[0097]FIG. 2B is a cross sectional view showing the semiconductorsubstrate jig according to a first embodiment of the present invention;

[0098] FIGS. 3A-3G are flow diagrams for explaining the method ofmanufacturing a semiconductor device according to the first embodimentof the present invention;

[0099] FIGS. 4A-4D are flow diagrams explaining in detail the method ofmanufacturing a semiconductor device according to a first embodiment ofthe present invention;

[0100] FIGS. 5A-5C are flow diagrams explaining in detail steps ofattaching a wafer to the jig;

[0101] FIGS. 6A-6G are flow diagrams explaining in detail the method ofmanufacturing a semiconductor device according to a second embodiment ofthe present invention;

[0102] FIGS. 7A-7I are flow diagrams explaining in detail the method ofmanufacturing a semiconductor device according to a third embodiment ofthe present invention;

[0103] FIGS. 8A-8I are flow diagrams explaining in detail the method ofmanufacturing a semiconductor device according to a fourth embodiment ofthe present invention;

[0104]FIG. 9A is a top view showing a semiconductor substrate jigaccording to the second embodiment of the present invention;

[0105]FIG. 9B is a cross sectional view showing the semiconductorsubstrate jig according to the second embodiment of the presentinvention;

[0106]FIG. 9C is a right side view showing the semiconductor substratejig according to the second embodiment of the present invention;

[0107]FIG. 10A-10E are diagrams showing the operations of thesemiconductor substrate jig according to the second embodiment of thepresent invention;

[0108]FIG. 11A-11H are flow diagrams explaining in detail the method ofmanufacturing a semiconductor device according to a fifth embodiment ofthe present invention;

[0109] FIGS. 12A-12H are flow diagrams explaining in detail the methodof manufacturing a semiconductor device according to a sixth embodimentof the present invention;

[0110]FIGS. 13A is a top view showing semiconductor substrate jigaccording to the third embodiment of the present invention;

[0111]FIG. 13B is a cross sectional view showing the semiconductorsubstrate jig according to the third embodiment of the presentinvention;

[0112]FIGS. 14A is a top view showing a semiconductor substrate jigaccording to the fourth embodiment of the present invention;

[0113]FIG. 14B is a cross sectional view showing the semiconductorsubstrate jig according to the fourth embodiment of the presentinvention;

[0114] FIGS. 15A-15H are flow diagrams explaining in detail the methodof manufacturing a semiconductor device according to a seventhembodiment of the present invention;

[0115]FIGS. 16A is a top view showing a semiconductor substrate jigaccording to the fifth embodiment of the present invention;

[0116]FIG. 16B is a cross sectional view showing the semiconductorsubstrate jig according to the fifth embodiment of the presentinvention;

[0117]FIG. 16C is a cross sectional view showing the state in which thelower jig and the upper jig are separated according to the fifthembodiment of the semiconductor substrate jig of the present invention;and

[0118]FIG. 17A-17J are flow diagrams explaining in detail the method ofmanufacturing a semiconductor device according to the eighth embodimentof the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0119]FIG. 2 shows a wafer-fixing jig 20 according to a first embodimentof the present invention. FIG. 2A is a top view of the wafer-fixing jig20, and FIG. 2B is a cross sectional view of the wafer-fixing jig 20.Components having the same structure as those previously described withreference to FIG. 1 are explained with the same reference numbers.

[0120] The wafer-fixing jig 20 generally includes for example, a rubberfilm 22, a set table 23, and a porous plate 24. The outer frame 21 is acylinder shaped member made from metal (ceramic and resin are alsopossible), and floor 25 is placed in the center (refer to FIG. 2B). Thesize of the outer frame 21 (diameter when seen from the top) is set tobe slightly larger than the external shape of the wafer 1. The rubberfilm 22 is arranged on the upper part of the floor formed in thewafer-fixing jig 20.

[0121] The rubber film 22 is made elastic by injecting fluids (in thisembodiment, air, but, other gases or fluids are also possible) inside.The rubber film 22 has a thickness of between 0.2 mm and 0.8 mm, and theuse of materials such as butyl rubber, fluorinated rubber, andethylene-propylene rubber is desirable considering the strength and theenvironment in which it is used.

[0122] Air is introduced from and exhausted to the inside of the rubberfilm 22 through a first air joint 26 provided in the floor 25. Thebottom part of the rubber film 22 is attached in an air tight manner tothe floor 25. Furthermore, a disk shaped set table 23 with the samediameter as that of the wafer 1 is arranged inside the rubber film 22.

[0123] On the under surface of the set table 23, four guide shafts 27and a second air joint 28 are provided. Each guide shaft 27 and thesecond air joint 28 are movably journaled to the floor 25.

[0124] The guide shafts 27 and the second air joint 28 are constructedso as to pass through the floor 25, but cause no air leakage where theguide shafts and the air joint pass through thanks to sealing membersarranged between the floor 25 and the guide shafts 27, as well asbetween the floor 25 and the air joint 28.

[0125] A porous plate 24 is arranged on the top surface of the set table23. The porous plate 24 is connected to the second air joint 28 andenables suction or air introduction.

[0126] An air supply/exhaust device (not shown) is connected to thefirst air joint 26 and the second air joint 28. An elevating mechanism(not shown) for elevating the set table 23 is connected to the guideshafts 27.

[0127] Next, a method of manufacturing a semiconductor device using theconstructed wafer-fixing jig 20 is explained.

[0128] The characteristics of the present invention can be found, forexample, in the attachment step, in the back grind step, in the tapereapplication step, in the singularization step, and in the pick upstep; and other manufacturing steps that refer to methods well known inthe art. Thus, the following descriptions only concern each of the abovesteps, and descriptions of other well-known manufacturing steps areomitted.

[0129]FIG. 3A through FIG. 3G show a method of manufacturing thesemiconductor device according to the first embodiment. First, aprotection tape 2 is attached to the wafer 1 by means of thewafer-fixing jig 20A, as shown in FIG. 3A. The protection tape 2 is alsoattached to the rubber film 22A of the wafer-fixing jig 20A. Althoughthe wafer-fixing jig 20A is the same as the wafer-fixing jig 20 shownpreviously in FIG. 2, because two jigs are used in this embodiment, theletters “A” and “B” are used to represent each jig and to distinguishone from the other.

[0130] The method of attaching the protection tape 2 to the wafer 1 bymeans of the wafer-fixing jig 20 is explained with reference to FIG. 4Athrough FIG. 4D.

[0131]FIG. 4A shows a state before the protection tape 2 is attached tothe wafer 1 (hereinafter referred to as an pre-attachment state). In thepre-attachment state, the wafer 1 is adsorbed and held by the wafer hand29 with the circuit-forming surface side facing down, as shown in thefigure. The previously explained wafer-fixing jig 20A is placed belowthe wafer 1. The protection tape 2 is provided between the wafer 1 andthe wafer-fixing jig 20A, by a device not particularly shown.

[0132] The protection tape 2 is a so-called double-sided tape withadhesive materials applied on both sides. The adhesives have a propertyin which heating decreases their adhesive strength. Therefore, if theheating temperature of the protection tape 2 is in a relationshipexpressed as (under surface temperature)>(top surface temperature), theadhesive strength of the under surface will first decrease and then theadhesive strength of the top surface will decrease as the temperaturerises.

[0133] In the pre-attachment state, air is pressured to the inside ofthe rubber film 22A from the first air joint 26A provided in the floor25, and the rubber film 22A expands and deforms outwardly from thecenter due to its property (refer to FIG. 4B). The deformation of rubberfilm 22A causes the protection tape 2 to be pushed toward the wafer 1.

[0134] As mentioned above, the adhesives are applied to both sides ofthe protection tape 2. For this reason, the protection tape 2 will beattached to the wafer 1 and at the same time to the rubber film 22A ofthe wafer-fixing jig 20A. This attachment is carried out ideally fromthe center toward the periphery so that there will be little chance ofbubbles entering between the protection tape 2 and the wafer 1.

[0135] When the wafer 1 is completely sandwiched from the top and thebottom between the wafer hand 29 and the rubber film 22A (the stateshown in FIG. 4C), the elevation mechanism is activated causing the settable 23A to rise, and be locked with the wafer 1 in a contacted mannerthrough the rubber film 22A and the protection tape 2.

[0136] Next, an air supply/exhaust device is activated, performing thesuction process through the second air joint 28A. Thus, a negativepressure is produced in the porous plate 24A and the rubber film 22A isadsorbed and is fixed to the porous plate 24A.

[0137] The attachment of the protection tape 2 to the wafer-fixing jig20A is completed through these operations, and the wafer hand 29 is thenremoved from the wafer 1. Finally, the protection tape 2 is cut tosubstantially the same diameter as that of the wafer 1. Attaching thewafer 1 to the wafer-fixing jig 20A through the protection tape 2 can beeasily carried out so that bubbles will not enter between them even ifthe attachment is not conducted under the vacuum environment.

[0138] Referring back to FIG. 3, the steps after the step of attachingthe wafer to the jig are explained.

[0139] After the attachment step mentioned above is completed, the nextstep in which the wafer 1 is transported along with the wafer-fixing jig20A to the back grind device (not shown) for thinning the back surfaceof the wafer is conducted. In the back grind device, the back surface ofthe wafer 1 is subjected to a grinding process. This process may be amechanical process, a chemical process, or any other process.

[0140] The set table 23A is locked at its top position and the rubberfilm 22A is adsorbed by the porous plate 24A due to the negativepressure. Thus, because the rubber film 22 is fixed to the porous plate24A, the wafer 1 attached to the rubber film 22 through the protectiontape 2 is also securely fixed to the wafer-fixing jig 20A.

[0141] However, it is sometimes better to have a mechanism where acertain degree of vibration during the back grinding process isabsorbed, depending on the thickness of the wafer 1 subjected to theback grinding process. The air pressure of about 0.01 Mpa to 0.05 Mpa isthen provided to the inside of the rubber film 22A, lowering the settable 23A slightly. The rubber film 22A acts as an air suspensiondevice. Since the wafer 1 will then be fabricated on the jig with an airsuspension function, the polishing quality will be more stable.

[0142] When the back grind step is completed, the wafer 1 is thinned andwarped, but this warping is not significant since the wafer 1 is fixedto the wafer-fixing jig 20A by the protection tape 2. Furthermore,although the strength of the wafer 1 is reduced because it is thinner,the wafer 1 does not break since the wafer-fixing jig 20A acts asreinforcement to the wafer 1.

[0143] After the above back grind step is completed, the next step,which is the tape reapplication step of reapplying the tape forsingularization, is conducted. The reapplication step is explained indetail with reference to FIG. 5.

[0144] In this embodiment, the wafer-fixing jig 20B is used in additionto the wafer-fixing jig 20A for conducting the reapplication step. Inother words, in this embodiment, two wafer-fixing jigs 20A, 20B (bothhaving the same construction) are used to conduct the tape reapplicationstep.

[0145] As shown in FIG. 5A, the wafer-fixing jig 20A with the wafer 1attached, having completed the back grind step, is turned upside downand then placed on top of the wafer-fixing jig 20B. A heating process isthen conducted on the protection tape 2 in a manner not shown in thefigure, and the adhesive strength of the surface contacting the wafer 1decreases due to the properties of the protection tape 2 used. Here, theadhesive strength of the surface on the side contacting the wafer-fixingjig 20A, which requires a higher heating temperature, is not yetdecreased (the adhesive strength still remains the same).

[0146] On the other hand, the wafer-fixing jig 20B is placed below thewafer-fixing jig 20A provided as above. Furthermore, a dicing tape 6 tobe applied to the back surface side of the wafer 1 is provided betweenthe wafer-fixing jig 20A and the wafer-fixing jig 20B.

[0147] An adhesive, with the property in which heating decreasesadhesive strength, is applied on both sides of the dicing tape 6. Theheating temperature for decreasing the adhesive strength of the adhesiveis set so that the heating temperature of the under surface (surfacefacing the rubber film 22B) is higher than the heating temperature ofthe top surface (surface facing the wafer 1).

[0148] When the wafer-fixing jig 20A with the wafer, and thewafer-fixing jig 20B are placed in a top and bottom position so as to beopposite one another and attached by the dicing tape 6, the wafer-fixingjig 20B in the lower position operates similar to that explained withreference to FIG. 4A through FIG. 4D.

[0149] Generally, introducing air from the first air joint causes thevolume of the rubber film 22B to increase, and the dicing tape 6 is thenattached to the back surface of the wafer 1 from the center outward. Thedicing tape 6 is also attached to the rubber film 22B.

[0150] Thereafter, the set table 23B rises and the rubber film 22B ispressed against the wafer 1 through the dicing tape 6. Next, a negativepressure is applied to the second air joint 28B and the rubber film 22Bis fixed to the porous plate 24A. After the above processes arecompleted, the wafer 1 is held between the wafer-fixing jig 20A and thewafer-fixing jig 20B, as shown in FIG. 5B.

[0151] Next, the set table 23A provided in the wafer-fixing jig 20A inan upper position is moved (upward direction in the figure) so as to beseparated from the wafer 1, and at the same time the air within therubber film 22A is exhausted through the first air joint 26A. As aresult, the volume of the rubber film 22A is smaller (contracts) due toits own elastic restoring force.

[0152] With the contraction of rubber film 22A, the protection tape 2 ispeeled from the boundary face of the wafer 1 having a decreased adhesivestrength caused by the heating process, as described above. When peelingthe protection tape 2 from the wafer 1, the operation performed will bethe reverse of that performed during attachment due to the properties ofthe rubber film 22A, and thus peeling the protection tape 2 from thewafer 1 is carried out from the periphery towards the center in adirection which is easier to peel (refer to FIG. 5C).

[0153] When the protection tape 2 is completely peeled from the wafer 1,the wafer-fixing jig 20A is removed. Afterwards, the dicing tape 6applied to the wafer-fixing jig 20B in the lower position is cut tosubstantially the same diameter as that of the wafer 1, and the tapereapplication step is completed. FIG. 3D shows a state in which the tapereapplication step is completed.

[0154] Naturally, in order to peel the tape attached to the jig having arigid body, the jig must be lifted up with the adhesive strength of thetape being zero, or must be slid laterally by performing a specialprocess. However, both are technically very difficult.

[0155] Nevertheless, it is possible according to the present inventionto carry out the reapplication process easily and securely by using thewafer-fixing jig 20A, 20B of the present embodiment, because thereapplication of the protection tape 2 and the dicing tape 6 areperformed utilizing the deformation of the rubber film 22A, 22B when thevolume increases and decreases. Furthermore, for the reasons mentionedabove, when attaching each tape 2, 6 to the wafer 1 or to the rubberfilm 22A, 22B, it is possible to prevent bubbles from entering.

[0156] Referring back to FIG. 3 again, steps following the tapereapplication step are explained.

[0157] After the tape reapplication step is completed, the wafer 1 istransferred to a dicing device in a state shown in FIG. 3D, in otherwords, in a state in which the wafer 1 is fixed to the wafer-fixing jig20B, and the singularization step for singularizing the wafer 1 intosemiconductor elements 10 is conducted.

[0158] The wafer 1 is cut to semiconductor elements 10, but, as shown inFIG. 3E, each semiconductor element is still aligned for each of themare fixed onto the wafer-fixing jig 20B through dicing tape 6 even afterthe singularization step. In the singularization step, a method ofdicing (cutting) the wafer 1 may be mechanical, optical or any otherform of method.

[0159] After the singularization step is completed, a pick up step forpicking up the semiconductor elements 10 from the wafer-fixing jig 20B(dicing tape 6), and a die bonding step for mounting the semiconductorelements 10 to the mounting substrate 9 are conducted, as shown in FIG.3F and FIG. 3G.

[0160] In the pick up step, the dicing tape 6 is subjected to a heatingprocess using a heating means not shown, and the adhesive strength ofthe surface of the dicing tape 6 contacting each semiconductor elementis decreased. Since the surface of the dicing tape 6 contacting therubber film 22B(wafer-fixing jig 20B) is applied with adhesiveconsisting of a material whose adhesive strength decreases at a highertemperature, the adhesive strength on the rubber film 22B side does notdecrease at this point of heating.

[0161] As the adhesive strength between the dicing tape 6 and thesemiconductor elements 10 decrease, a collet 8 moves and adsorbs thesemiconductor elements through vacuum, and picks up the elements fromthe dicing tape 6. Here, it is ensured that even thinned semiconductorelements 10 with a decreased strength can be securely picked up withoutdamage because of the decreased adhesive strength.

[0162] The picked up semiconductor elements 10 are transferred to apredetermined position on, for example, the mounting substrate 9 and aredie bonded to the mounting substrate 9. After the pick up step and thedie bonding step are conducted for all the semiconductor elements 10attached to the dicing tape 6, the protection tape 2 and the dicing tape6 are peeled from the rubber film 22A, 22B, respectively, by conductinga further heating process at a higher temperature. The wafer-fixing jigs20A, 20B can be recycled.

[0163] As explained above, according to this embodiment, the warping ofthe thinned wafer 1 is not significant and the performance of each stepis not degraded. Furthermore, although the wafer 1 has a decreasedstrength due to being thinned, the wafer-fixing jigs 20A, 20B to whichthe wafer 1 is attached reinforce the wafer and thus no breakage failurewill occur. Furthermore, it is possible to carry out the step ofreapplying the protection tape 2 with the dicing tape 6 withoutperforming a special process by using the wafer-fixing jigs 20A, 20B.

[0164] Now, a second embodiment of the present invention according tothe method of manufacturing a semiconductor device is explained.

[0165]FIG. 6 is a flow diagram of a method of manufacturing asemiconductor device according to a second embodiment. In thisembodiment as well, each manufacturing step is performed using thewafer-fixing jig 20 shown in FIG. 2.

[0166] In FIG. 6, components the same as those shown in FIG. 3 throughFIG. 5 have the same reference numbers and thus their explanations areomitted. Steps the same as those explained in the first embodiment areomitted to avoid redundancy of the explanation. This holds for each ofthe subsequent embodiments explained after the second embodiment.

[0167] In this embodiment, the attachment step and the back grind stepare carried out in a similar manner as those explained in the firstembodiment. This embodiment, however, is characterized in that in thetape reapplication step following the back grind step, a conventionallyused frame 5 arranged with a dicing tape 6 is used as the wafer-fixingjig instead of the wafer-fixing jig 20.

[0168] In the structure of this embodiment, it is necessary to apply thewafer 1 to the dicing tape 6 arranged in the frame 5. Here, there is apossibility that bubbles may enter between the wafer 1 and the dicingtape 6, but although not as completely compared to the first embodiment,the entering of bubbles may be prevented by adopting an attachmentmethod of pressing down with rollers, or an attachment method under avacuum.

[0169] According to this embodiment, because there is no need for thedicing tape 6 to be attached to the wafer-fixing jig 20, a step ofirradiating ultraviolet rays may be performed before the subsequentlyperformed pick up step, and the flexible ultraviolet curing tape may beused as the dicing tape 6, thus reducing the manufacturing costs.

[0170] Next, a third embodiment according to the method of manufacturingthe semiconductor device is explained.

[0171]FIG. 7A through FIG. 7I show flow diagrams of a method ofmanufacturing the semiconductor device according to a third embodiment.In this embodiment as well, each manufacturing step is performed usingthe wafer-fixing jig 20 shown in FIG. 2. In this figure, twomanufacturing methods in which one flows as FIG. 7A→FIG. 7B→FIG. 7C→FIG.7D→FIG. 7E→FIG. 7F→FIG. 7G (manufacturing method 1) and the other flowsas FIG. 7A→FIG. 7B→FIG. 7C →FIG. 7H→FIG. 7I→FIG. 7G (manufacturingmethod 2) are shown in the same diagram for convenience.

[0172] In this embodiment, the attachment step and the back grind stepare the same as those shown according to the first embodiment (refer toFIG. 3). However, this embodiment is characterized in that in the firstembodiment, the tape reapplication step is conducted after the backgrind step, whereas in this embodiment the singularization step isconducted after the back grind step.

[0173] In the manufacturing method 1, the singularization step is notnecessarily performed after the tape reapplication step, and it ispossible to arbitrarily change the order of the singularization step andthe tape reapplication step. Thus, the degree of freedom in designingthe steps is enhanced, and the equipment may be effectively operated. Inthe manufacturing method 1 of this embodiment, two wafer-fixing jigs 20Aand 20B are used to perform the tape reapplication step, but asexplained with reference to FIG. 6, it is also possible to use thedicing tape 6 arranged in the frame 5.

[0174] In the manufacturing step 2, it is possible to shift to the pickup step and the die bonding step immediately after completing thesingularization step. In other words, according to the manufacturingmethod 2, it is possible to eliminate the tape reapplication step. Thus,it is possible to reduce the number of processes compared to theconventional art, and thus reduce the cost and shorten the process time,while facilitating the transportation of the thinned and warped wafer 1,and reinforcing the wafer 1 of decreased strength.

[0175] However, it is necessary to perform the die bonding step afterthe semiconductor elements 10 picked up by collets 8A, 8B, as shown inFIG. 7H, are turned upside down as shown in FIG. 7I, since it isnecessary for the back surface of the semiconductor elements 10 to beplaced opposite the mounting substrate 9 during the die bonding step.The time needed for turning upside down is extremely short compared tothe time needed for the tape reapplication.

[0176] Next, a method of manufacturing a semiconductor device accordingto a fourth embodiment of the present invention is explained.

[0177]FIG. 8A through FIG. 8I show flow diagrams of the method ofmanufacturing a semiconductor device according to the fourth embodiment.In this figure as well, two manufacturing methods in which one flows asFIG. 8A→FIG. 8B→FIG. 8C→FIG. 8D→FIG. 8E→FIG. 8F→FIG. 8G (manufacturingmethod 1) and the other flows as FIG. 8A→FIG. 8B→FIG. 8C→FIG. 8H→FIG.8I→FIG. 8G (manufacturing method 2) are shown in the same diagram forconvenience.

[0178] This embodiment is characterized in that the singularization stepis performed after the attachment step. Furthermore, this embodiment isconstructed to perform the back grind step and the tape reapplicationstep after the singularization step is completed.

[0179] In the manufacturing method 1, the singularization step is notnecessarily performed after the tape reapplication step, and it ispossible to arbitrarily change the order of the back grind step, thesingularization step, and the tape reapplication step. Thus, the degreeof freedom in designing the steps is enhanced and the equipment may beeffectively operated.

[0180] Although two wafer-fixing jigs 20A and 20B are used to performthe tape reapplication step in the manufacturing method 1 of thisembodiment, it is also possible to use the dicing tape 6 arranged in theframe 5, as explained with reference to FIG. 6.

[0181] In the manufacturing step 2, it is possible to shift to the pickup step and the die bonding step immediately after completing thesingularization step and the back grind step. In other words, the tapereapplication step may also be eliminated in the manufacturing method 2.

[0182] Therefore, the number of processes is reduced compared to theconventional art, and thus the cost is reduced and the process timeshortened, while the transfer of thinned and warped wafer 1 isfacilitated, and the wafer 1 with a decreased strength is reinforced.Furthermore, since the back grind process is carried out after thesemiconductor elements 10 are singularized, the microscopic fragments ofthe edge portion of the semiconductor elements 10 formed during thesingularization step may be removed by the back grind process, and thusthe strength of the semiconductor elements 10 may be enhanced.

[0183] However, in this method, it is necessary to perform the diebonding step after the semiconductor elements 10 are turned upside downby collets 8A, 8B as shown in FIG. 8I. Nevertheless, the time needed forthis turning is extremely short compared to the time needed for the tapereapplication as mentioned before.

[0184] Next, a wafer-fixing jig according to a second embodiment of thepresent invention is explained.

[0185]FIG. 9A through FIG. 9C show a wafer-fixing jig 30 according tothe second embodiment. FIG. 9A is a top view of the wafer-fixing jig 30,FIG. 9B is a cross sectional view taken along line A-A of thewafer-fixing jig 30 shown in FIG. 9A, and FIG. 9C is the right side viewof the wafer-fixing jig 30.

[0186] The wafer-fixing jig 30 is a jig used for attaching theprotection tape 2 and the dicing tape 6 to the wafer 1, and for holdingthe wafer 1 applied with tape in a similar way as the above-describedwafer-fixing jig 20(refer to FIG. 2). The wafer-fixing jig 30 isgenerally constructed of an outer frame 31, a set of step rings 32, anda thrust bar 35(shown in FIG. 10).

[0187] The outer frame 31 is a cylindrical member having a bottom, andmade from metal (ceramic and resin are also possible). The diameter ofthe outer frame when viewed from the top is set to be somewhat largerthan the diameter of the wafer 1. Furthermore, a set of step rings 32(aset of ring shaped member) is placed within the outer frame 31.Furthermore, a pair of grooves 34 is formed on the sidewalls of theouter frame 31, from which grooves 34 the thrust bar 35(operatingmember) is inserted as will be described later.

[0188] The set of step rings 32 includes plural ring shaped step rings32 a through 32 i (only step ring 32 i has a substantially circularshape). These step rings 32 a through 32 i are arranged concentricallywithin the outer frame 31. In other words, the diameters of the steprings are sequentially larger in the order of step ring 32 h→step ring32 g→ . . . → step ring 32 a with the step ring 32 i being the center.

[0189] Furthermore, the heights in the up and down direction (in thedirection perpendicular to the wafer 1, up and down direction in FIG.9B) of the step rings 32 a through 32 i are constructed so that theheight gradually gets higher from step ring 32 a in the outer mostcircumference towards step ring 32 i in the inner most circumference.Thus, as shown in FIG. 9B, the height in the up and down direction ofthe step ring 32 a in the outer most circumference has the minimumheight H_(A), and the height in the up and down direction of the stepring 32 i in the inner most circumference has the maximum height H_(I).

[0190] Furthermore, each step ring 32 a through 32 i is constructed soas to be individually movable in the up and down direction. However, atension spring 33 (bias member) whose one end is connected to the bottomof the outer frame 31 is connected to each step ring 32 a through 32 i.Thus, in the non-operating state (in which thrust bar 35 is notinserted) shown in FIG. 9B, each step ring 32 a through 32 i is biasedto the bottom of the outer frame 31 and is in a moved down position. Inthis state, the top surfaces of each step rings 32 a through 32 i aremade substantially flat.

[0191] The thrust bar 35 is a rod shaped member, and is inserted insidethe outer frame 31 from groove 34 as mentioned above. Furthermore, thetip of the thrust bar 35 has a tapered portion, as shown in FIG. 10.

[0192] Next, the operations of the above constructed wafer-fixing jig 30are explained with reference to FIG. 10.

[0193]FIG. 10A shows a non-operating state. In the non-operating state,the top surface of each step rings 32 a through 32 i of the set of steprings 32 is flat as mentioned above.

[0194] As the thrust bar 35 is inserted inside the outer frame 31 fromthe groove 34 as shown in FIG. 10B, the tapered portion at the tip ofthe thrust bar engages with the step rings 32 a through step ring 32 ione by one, biasing and moving up each step ring 32 a through 32 i.

[0195] Here, because there is a height difference between each step ring32 a through 32 i, when a certain step ring is moved up, all the steprings located internal to that step ring will all move up. Generally, asshown in FIG. 10B, when the thrust bar 35 causes the step ring 32 a inthe outer most circumference to move up, the step rings 32 b through 32i internal to the step ring 32 a are simultaneously moved up while stillmaintaining a flat state.

[0196] Subsequently, as shown in FIG. 10C, when the thrust bar 35 causesthe step ring 32 b located one ring internal to the step ring 32 a tomove up, the step rings 32 c through 32 i internal to the step ring 32 bare simultaneously moved up while still maintaining a flat state.Furthermore, as shown in FIG. 10D, when the thrust bar 35 causes thestep ring 32 c located one ring internal to step ring 32 b to move up,the step rings 32 d through 32 i internal to the step ring 32 c aremoved up simultaneously while still maintaining a flat state.

[0197] Similar operations are performed repeatedly a number of times asthe thrust bar 35 is inserted, and when the bar 35 is completelyinserted (hereinafter referred to this condition as the operationcomplete state), as shown in FIG. 10E, the set of step rings 32 forms amountain like shape with the center step ring 32 i being the highestpoint (height H_(I)), and the step ring 32 a being the lowest point(height H_(A)). When the thrust bar 35 is retracted from the outer frame31, each step ring 32 a through 32 i operate in a reverse manner as theoperations stated above. The material of each step ring 32 a through 32i consists of metal, ceramic, and resin, and the appropriate differencein height between each step ring 32 a through 32 i is about 0.5 to 2 mm,and the width is about 2 to 10 mm.

[0198] Next, a method of manufacturing a semiconductor device using theabove constructed wafer-fixing jig 30 is explained.

[0199] The characteristics of this embodiment can be found in theattachment step, the back grind step, the tape reapplication step, thesingularization step, and the pick up step, and other manufacturingsteps use the well-known method. For this reason, the followingexplanations only concern each of the above-explained steps andexplanations regarding other well-known manufacturing steps are omitted.

[0200]FIG. 11A thorough FIG. 11H show the method of manufacturing asemiconductor device according to a fifth embodiment. First, as shown inFIG. 11A, protection tape 2 is attached to the wafer 1 using thewafer-fixing jig 30A (step for attaching the wafer to the jig). Here,the protection tape 2 is also attached to the top surface of the set ofstep rings 32 of the wafer-fixing jig 30A. The wafer-fixing jig 30A isthe same as the wafer-fixing jig 30 shown in FIG. 9, but because twojigs are used as will be stated later in this embodiment, the letters“A” and “B” are used to represent each construction and to distinguishone from the other.

[0201] To attach the protection tape 2 to the wafer 1, the wafer-fixingjig 30A must be in the operation complete state beforehand. Theprotection tape 2 is provided between the wafer 1 and the wafer-fixingjig 30A, and the wafer-fixing jig 30A is partially in contact with thewafer 1 through the protection tape 2.

[0202] In the state shown in FIG. 11A, only the center step ring 32 i ofthe set of step rings 32 partially contacts the protection tape 2because the wafer-fixing jig 30A is in an operation complete state asmentioned above. The adhesives, with the property that heating decreasestheir adhesive strength, are applied to both sides of the protectiontape 2. In this embodiment, the temperature characteristics of theadhesives applied to the top and the under surfaces of the protectiontape 2 is made the same.

[0203] Next, the thrust bar 35 is pulled in the direction shown by thearrows in FIG. 11A. Each of the step rings 32 a through 32 i of thewafer-fixing jig 30A gradually lowers from the center outward.

[0204] The wafer hand 29 holds the wafer 1, but synchronizes with thelowering action of each step ring 32 a through 32 i, and is constructedto drop an amount corresponding to the amount of the lowering stroke.Thus, the set of step rings 32 and the wafer 1 are always in a contactedstate even while each of the step ring 32 a through 32 i is moving.Then, the thrust bar 35 is pulled further out, and when the bar iscompletely pulled out of the outer frame 31 (i.e. non-operating state),the top surface of the set of step rings 32 is flat.

[0205] The series of actions of the set of step rings 32 (step ring 32 athrough 32 i) are actions in which step rings 32 a through 32 igradually rise relatively from the center outward when seen from thewafer 1. With these actions of step ring 32 a through 32 i, theprotection tape 2 is attached to the wafer 1 and to the top surface ofthe set of step rings 32.

[0206] Here, the protection tape 2 is attached a step at a time from thecenter of the wafer 1 outward because the step rings 32 a through 32 isequentially rise relatively from the center outward. Thus, even ifbubbles exist between the wafer 1 and the protection tape 2, the bubblesare pushed outward due the above action of the step rings 32 a through32 i, and eventually no bubbles will exist between the wafer 1 and theprotection tape 2. Thus even in the attachment process in thisembodiment, the attachment is carried out ideally from the centeroutward so that there is little chance of bubbles entering between theprotection tape 2 and the wafer 1.

[0207] When the protection tape 2 is attached to the wafer 1 and the topsurfaces of the set of step rings 32, the wafer hand 29 is removed fromthe wafer 1, and the protection tape 2 is cut to substantially the samediameter as that of the wafer 1. Consequently, the attachment step iscompleted. As stated above, in this embodiment as well, the attachmentbetween the wafer 1 and the protection tape 2 can be readily carried outso that no bubbles will enter even if the attachment is not conducted ina vacuum environment, by using the wafer-fixing jig 30A.

[0208] After the attachment step is completed, as shown in FIG. 11B, theback grind step is conducted. The back grind step is conducted to thewafer 1 fixed to the wafer-fixing jig 30A. The general method of thegrinding process may be a mechanical process, a chemical process or anyother processes.

[0209] When the back grind step is completed, the wafer 1 is thinned andwarped, but because wafer 1 is fixed to the wafer-fixing jig 30A by theprotection tape 2, the warping is not significant. The strength of thewafer 1 is decreased due to being thinned, but since wafer-fixing jig30A serves to reinforce the wafer 1, wafer 1 will not break.

[0210] After the back grind step is completed, the die attach mount stepshown in FIG. 11C is conducted. In the die attach mount step, a dieattach film 37 is applied to the back surface of the wafer 1.

[0211] The die attach film is applied by means of a method of pushingdown with for example, rollers not shown in the figure. The die attachfilm is, as will be stated later, a material for securing thesemiconductor elements 10 and the mounting substrate 9 when mounting thesemiconductor elements 10 to the mounting substrate 9.

[0212] When the die attach film 37 is applied to the back surface of thewafer 1, and in case it is necessary to change the temperature dependingon the type of the die attach film 37, a heating mechanism is providedin the wafer-fixing jig 30A with which the die attach film 37 is heated.

[0213] After the die mount step is completed, the tape reapplicationstep is conducted. In this embodiment, the wafer-fixing jig 30B is usedin addition to the wafer-fixing jig 30A to carry out the tapereapplication step. In other words, in this embodiment, the tapereapplication process is conducted using two wafer-fixing jigs 30A and30B (both having the same construction).

[0214] As shown in FIG. 11D, the wafer-fixing jig 30A, with the wafer 1having completed the back grind step attached, is turned upside down andplaced on top of the wafer-fixing jig 30B. Heating process is conductedto the protection tape 2 in a manner not shown in the figure, and theadhesive strength of each of the adhesives applied to both sides of theprotection tape 2 decreases.

[0215] In the wafer-fixing jig 30B in the lower position, a double-sidedtape 36 is applied to the top surfaces of the set of step rings 32B. Anadhesive whose adhesive strength is decreased by heat application isapplied to both sides of the double-sided tape 36. The temperaturecharacteristics of the adhesive are set so that the temperature fordecreasing the adhesive strength of the adhesive applied to the topsurface of the double-sided tape 36 (the surface opposite the wafer 1)is higher than the temperature for decreasing the adhesive strength ofthe adhesive applied to the under surface of the double-sided tape 36(surface opposite the wafer-fixing jig 30B).

[0216] The wafer 1 fixed on the wafer-fixing jig 30A is attached to thedouble-sided tape 36. Here, each step ring 32 a through 32 i of thewafer-fixing jig 30B perform a similar action as those stated above, andthus the attachment of the double-sided tape 36 and the wafer 1 proceedsfrom the center outward. It is possible to prevent bubbles from enteringbetween the double-sided tape 36 and the wafer l(generally, die attachfilm 37). After a series of processes are completed, the wafer 1 will besandwiched between the wafer-fixing jig 30A and the wafer-fixing jig30B.

[0217] Next, the wafer-fixing jig 30A in the upper position is operatedand the thrust bar 35 is inserted to the inside of the outer film 31.With this action, the step rings 32 a through 32 i are gradually loweredfrom the outer circumference toward the center (lowering or droppingrefers to the movement in a direction in which the step rings 32 athrough 32 i separate from the wafer 1).

[0218] With the movement of each step ring 32 a through 32 i, the entirewafer-fixing jig 30A is raised (upward movement in FIG. 11).

[0219] Due to this action, the peeling at the boundary face between thewafer-fixing jig 30A and the protection tape 2 proceeds. This is areverse action to the attachment action and peeling starts from theouter circumference toward the center in a direction easier to proceed.Eventually, the protection tape 2 is completely peeled from thewafer-fixing jig 30A.

[0220] As shown in FIG. 11E, the remainder of the protection tape 2 ispeeled from the wafer 1. The peeling process of the protection 2 iseasily performed because heating decreases the adhesive strength of theadhesives applied to the protection tape 2, and because the tape body ofthe protection tapes 2 is soft. After peeling, the double-sided tape 36is cut to substantially the same diameter as that of the wafer 1 andfinally the series of processes for the tape reapplication step iscompleted.

[0221] After the reapplication step is completed, the singularizationstep for singularizing the wafer 1 into semiconductor elements 10, thepick up step, and the die bonding step are performed, but besides thefact that wafer 1(semiconductor elements 10) is fixed onto thewafer-fixing jig 30B, each step is not different from the steps in themanufacturing method related to the first embodiment with reference toFIG. 3, and thus their explanations are omitted. By peeling thedouble-sided tape 36 from the set of step rings 32, the wafer-fixing jig30B can be recycled.

[0222] Next, a method of manufacturing the semiconductor deviceaccording to a sixth embodiment is shown.

[0223]FIG. 12A through FIG. 12H show flow diagrams of the method ofmanufacturing the semiconductor device according to the sixthembodiment. In this embodiment as well, each manufacturing step isconducted using the wafer-fixing jig 30 shown in FIG. 9.

[0224] In FIG. 12A through FIG. 12H, components same as those shown inFIG. 9 through FIG. 11 have the same reference numbers and thus theirexplanations are omitted to avoid redundancy.

[0225] In this embodiment, the attachment step and the back grind stepare carried out in a similar way to those explained in the fifthembodiment. This embodiment, however, is characterized in thatconventionally used frame 5 arranged with the dicing tape 6 is used asthe wafer-fixing jig instead of the wafer-fixing jig 30.

[0226] In the structure of this embodiment, it is necessary to attachthe wafer 1 to the dicing tape 6 arranged in the frame 5 in the tapereapplication step. Here, there is a possibility that bubbles enterbetween the wafer 1 and the dicing tape 6, but by adopting the method ofpressing down with rollers or conducting the attachment process in avacuum environment, it is possible, although not as completely as shownin the fifth embodiment, to prevent bubbles from entering.

[0227] In this embodiment, since there is no need for dicing tape 6 tobe attached to the wafer-fixing jig 30, the ultraviolet irradiation stepcan be conducted before the subsequently performed pick up step, and theflexible ultraviolet curing tape used nowadays can be used as the dicingtape 6, thus reducing the manufacturing cost.

[0228] In the manufacturing method described in the fifth and the sixthembodiments, the wafer-fixing jig 30 shown in FIG. 9 it used. However,such manufacturing method of the fifth and the sixth embodiments shownin FIG. 11 and FIG. 12, respectively, can be performed withoutnecessarily using the wafer-fixing jig 30.

[0229]FIG. 13A and 13B show a wafer-fixing jig 40 according to the thirdembodiment, in which the wafer-fixing jig 40 is alternatively usable asthe wafer-fixing jig 30.

[0230] The wafer-fixing jig 40 includes an outer frame 41 and a porousmember 42. The outer frame 41 has a somewhat larger diameter than thediameter of the installed wafer 1. A vacuum pore 43 is formed in thecenter of the under part of the outer frame 41, and the vacuum pore 43is connected to the vacuum device not shown. The outer frame 41 iscomposed of metal, ceramic, or resin.

[0231] The porous member 42 is arranged within the outer frame 41 andhas substantially the same diameter as that of the installed wafer 1.The porous member 42 is connected to the vacuum pore 43 formed in theouter frame 41, and adsorbs the wafer 1 placed on the top thereof.

[0232] Through the use of the constructed wafer-fixing jig 40, it ispossible to prevent bubbles from entering between the wafer-fixing jig40 and each tape 2, 36 by suctioning while attaching the protection tape2 and the double-sided tape 36 to the wafer-fixing jig 40. The tapes 2,36 may be easily peeled from the wafer-fixing jig 40 by emitting air.

[0233] Next, a method of manufacturing the semiconductor deviceaccording to a seventh embodiment of the present invention is shown.

[0234]FIG. 15A through FIG. 15H show flow diagrams showing the method ofmanufacturing the semiconductor device according to the seventhembodiment. In this embodiment, a disc 45 shown in FIG. 14 is used. Thedisc 45 is composed of a disc having substantially the same diameter asthat of the wafer 1. The appropriate thickness of the disc is between 1mm to 5 mm and the preferred material is quartz glass that transmitslight.

[0235] As shown in FIG. 15A, the wafer 1 is attached to the aboveconstructed disc 45 using the double-sided tape 46. The double-sidedtape 46 may be a flexible ultraviolet curing double-sided adhesive tape.The process of attaching the wafer 1 to the double-sided tape 46 canuse, for example, the method of pushing down with rollers, or the methodof applying the double-sided tape 46 to the wafer 1 under a vacuumenvironment. The double-sided tape 46 is attached to the disc 45 afterit is attached to the wafer 1.

[0236] After the attachment step is completed, the wafer 1 is subjectedto the back grind process while fixed on the disc 45(back grind step) asshown in FIG. 15B. After the back grind step is completed, the firstultraviolet irradiation step is performed, as shown in FIG. 15C.

[0237] In the first irradiation step, the ultraviolet rays irradiate theadhesives applied to the double-sided tape 46 through the disc 45 havingthe property of light transmission. Thus, the adhesives applied to thedouble-sided tape 46 are cured and the adhesive strength is decreased.

[0238] After the first ultraviolet irradiation step is completed, thetape reapplication step is conducted. In the tape reapplication step,the wafer 1 fixed to the disc 45 is turned upside down and the backsurface of the wafer 1 is attached to the dicing tape 6 arranged in theframe 5, as shown in FIG. 15D. Here, the back surface of the wafer 1 maybe attached to the dicing tape 6 after the die attach film 37 ismounted.

[0239] The ultraviolet curing adhesives may be applied to the dicingtape 6 beforehand through which the wafer 1 is attached to the dicingtape 6. Through the attachment method by pressing down with rollers andthe attachment method of performing under vacuum environment, the wafer1 and the dicing tape 6 are attached to one another without havingbubbles between them.

[0240] After the tape reapplication step is completed, the disc 45 isremoved and the singularization step is conducted. The wafer 1 issingularized into semiconductor elements 10. Thereafter, a secondultraviolet irradiation step is conducted, and ultraviolet rays areirradiated from the side of the back surface of the dicing tape 6(fromthe under surface side in the figure). The adhesive strength of theultraviolet curing type adhesive applied to the dicing tape 6 decreases.The pick up step and the die bonding step are conducted in the samemanner as previously described, and the semiconductor elements 10 aremounted to the mounting substrate 9.

[0241] According to this embodiment, since disc 45 having the propertyof light transmission is used as the fixing jig for wafer 1, it ispossible to perform ultraviolet irradiation from the under surface ofthe disc 45 in the subsequent steps. Thus, the flexible ultravioletirradiation tape used conventionally nowadays can still be used and therunning costs may be reduced.

[0242] Next, a method of manufacturing the semiconductor deviceaccording to an eighth embodiment is shown.

[0243]FIG. 16A through FIG. 16C show a wafer-fixing jig 50 used in themethod of manufacturing the semiconductor device according to the eighthembodiment, and FIG. 17A through FIG. 17J show flow diagrams of themanufacturing method of the semiconductor device according to the eighthembodiment.

[0244] The wafer-fixing jig 50 is explained with reference to FIG. 16.The wafer-fixing jig 50 is generally composed of a lower jig 51 and anupper jig 52. These lower jig 51 and upper jig 52 are constructed so asto be combinable. The combined lower and upper jigs are secured with ahook 59 and thus the lower jig 51 and the upper jig 52 are unified.

[0245] The lower jig 51 is composed of metal (stainless) or ceramics,and a wafer installation part 61 for installing the wafer 1 (samediameter as the size of the diameter of the wafer W) is formed withinthe lower jig 51. A protection member 54 for protecting thecircuit-forming surface is arranged on the wafer installation part 61.The protection member 54 consists of a porous protection member(rubber).

[0246] The lower vacuum hole 53 is formed in the lower jig 51. One endof the lower vacuum hole 53 is connected to the lower air joint formedon the side of the lower jig 51. A suction device not shown in thefigure is connected to the lower air joint 56. The other end of thelower vacuum hole 53 branches out into plural branches and opens uptowards the wafer installation part 61.

[0247] As the negative pressure is applied to the lower air joint 56 bydriving the suction device, the wafer 1 installed to the waferinstallation part 61 is adsorbed by the lower vacuum hole 53. The wafer1 is constructed so as to be held by the lower jig 51. A detent pin 55is a pin used as a positioning pin when the lower jig is being combinedwith the upper jig 52, and used to prevent rotation of each jigs 51 and52 after having been combined.

[0248] Plural escape grooves for dicing 58 are formed in the upper jig52. These grooves are formed so that the dicing saw does not damage theupper jig 52, since the wafer 1 is subjected to the dicing process whilebeing held by the upper jig 52, as will be described later. An uppervacuum hole 57 is provided in the upper jig 52.

[0249] One end of the upper vacuum hole 57 is connected to an upper airjoint 60 formed on the side of the upper jig 52. A suction device notshown in the figure is connected to the upper air joint 60. The otherend of the upper vacuum hole 57 branches into several branches and opensdown towards the installation position of the wafer 1 (opens towards aposition between the dicing escape grooves 58).

[0250] As the negative pressure is applied to the upper air joint 60 bydriving the suction device, the wafer 1 installed to the upper jig 52 isadsorbed by the upper vacuum hole 57. Wafer 1 is constructed so as to beheld by the upper jig 52. Here, the lower air joint 56 and the upper airjoint 60 are connected to independent suction device, and thus, thelower vacuum hole 53 and the upper vacuum hole 57 can independentlycarry out the suction process to the wafer 1.

[0251] Next, a method of manufacturing a semiconductor device using theconstructed wafer-fixing jig 50 is explained with reference to FIG. 17.

[0252] In this embodiment, the wafer 1 is installed to the lower jig 51so that the back surface of the wafer 1 is facing up, and at the sametime, the negative pressure is applied to the lower vacuum hole 53 andthe wafer 1 is held by the lower jig 51, as shown in FIG. 17A. Here, theprotection member 54 is applied to where the circuit-forming surface ofthe wafer 1 contacts the lower jig 51, and thus circuit-forming surfaceis not damaged through suction.

[0253] As shown in FIG. 17B, the back surface of the wafer 1 issubjected to the back grind step while being held by the lower jig 51.The back grind process may be a mechanical process, a chemical processor any other processes. At this point, the wafer 1 may be warped butthis warping is not significant since it is suctioned by the lower jig51.

[0254] As shown in FIG. 17C, the lower jig 51 and the upper jig 52 arecombined, and the wafer 1 is sandwiched from the top and the bottom.Here, the wafer 1 is installed inside the wafer-fixing jig 50, and heldby each jigs 51, 52, and thus the suction process may be turned off. Ifthe suction process is turned on, the wafer 1 may be more securely heldand the warping may be more reliably prevented.

[0255] The wafer 1 is pulled out of the back grind device while beingsandwiched by each jigs 51, 52 (in a state installed inside thewafer-fixing jig 50), then proceeds to the die attach film 37application step. In this step, as the upper jig 52 is removed from thelower jig 51, the die attach film 37 is applied to the back surface ofthe wafer 1 using rollers not shown, as shown in FIG. 17D. If it isnecessary to apply heat depending on the type of the die attach film 37,heating mechanism may be provided on the table at the side of the devicefor setting the lower jig 51 (die attach mount device).

[0256] After the die attach mount process is completed, the upper jig 52is combined with the lower jig 51 again from the top and is in a stateto be transported. The wafer 1 is transported to the dicing device inthis state and is installed to the table inside the dicing device.

[0257] As shown in FIG. 17F, the wafer-fixing jig 50 is turned upsidedown and set on the table inside the dicing device so that thecircuit-forming surface of the wafer 1 is facing upward. The suctionprocess of the upper jig 52 is turned on, and the wafer 1 is held by theupper jig 52. When the wafer 1 is securely held by the upper jig 52, thelower jig 51 is removed from the upper jig 52.

[0258] The wafer 1 is subjected to the dicing process in this state, asshown in FIG. 17G. The wafer 1 is cut to semiconductor elements 10. Upondicing, the wafer 1 is generally cut to pieces using a dicing saw, butbecause dicing escape grooves 58 are formed in a position correspondingto the dicing position of the upper jig 52, as stated above, the upperjig 52 will not be damaged by the dicing saw. Furthermore, since theopenings of the upper vacuum hole 57 are also provided opposite thesemiconductor elements 10, the semiconductor elements 10 are securelyheld by the upper jig 52 even if they are cut to pieces.

[0259] As shown in FIG. 17H, the lower jig 51 and the upper jig 52 areagain combined and the wafer 1 is transferred to the next step, the diebonder, and is installed. As the wafer-fixing jig 50 is installed on thetable of the die bonder, the negative pressure is applied to the uppervacuum hole 57 of the upper jig 52, and each of the semiconductorelements 10 is held by the upper jig 52. After the semiconductorelements 10 are securely held by the upper jig 52, the lower jig 51 isremoved from the upper jig 52.

[0260] The pick up/bonding process is carried out to semiconductorelement 10 individually in the die bonder, as shown in FIG. 17I and FIG.17J. When the semiconductor elements 10 are picked up, the suction ofthe upper jig 52 is turned off and only the suction of the collet 8 isturned on.

[0261] In this embodiment, since there is no need for peeling thesemiconductor element 10 from the tape, a special treatment of pushingup the semiconductor from the under surface with a needle isunnecessary. Thus, it is possible to have zero damage to the thinnedsemiconductor element 10 caused by the needle, and the damage of thesemiconductor element 10 is prevented.

[0262] In this embodiment, as stated above, when wafer 1 is subjected tothe processes in each step, the wafer 1 is held either by the lower jig51 or the upper jig 52, and when being transported between each step,the wafer 1 is sandwiched between the lower jig 51 and the upper jig 52.Thus even with the thinned wafer 1, warping is not significant andperformance will improve. Furthermore, damage failure caused bytransportation will not arise.

[0263] The wafer-fixing jigs 20, 30, 40, and 50 used in each of theabove manufacturing steps are all stackable one on top of the other, andthe conventionally used dedicated carrier is no longer necessary whentransporting between steps. Thus, not only are the costs needed for theindirect tools reduced, but also there will be no damage when storingand taking out the jigs. By adding barcodes to the wafer-fixing jigs 20,30, 40, and 50, it is possible to manage information about the wafer 1.

[0264] According to the present invention, various advantages describedbelow may be achieved.

[0265] According to one feature of the present invention, since thesemiconductor substrate is fixed to the semiconductor substrate jigwithout warps occurring in the semiconductor substrate, thesingularization step of the semiconductor substrate may be carried outsmoothly.

[0266] Further, according to another feature of the present invention,since the semiconductor substrate is fixed to the semiconductorsubstrate jig without warps occurring in the semiconductor substrate,the back grinding step of the semiconductor substrate may be carried outsmoothly.

[0267] According to one feature of the present invention, it is possibleto prevent bubbles from remaining between the semiconductor substrateand the film, and thus the steps that follow can be conducted smoothlyand at the same time damage of the semiconductor substrate due to theentering of bubbles may be prevented.

[0268] According to another feature of the present invention, it ispossible to prevent bubbles from remaining between the semiconductorsubstrate and the first adhesive tape, and because the semiconductorsubstrate can be securely held by the semiconductor substrate jig in theback grind step, the back grind step can be conducted smoothly.

[0269] According to another feature of the present invention, aftercompleting the back grind step, the tape reapplication step may beconducted before or after the sigularization step. Thus, the degree offreedom in designing steps of semiconductor manufacturing is enhanced.

[0270] According to another feature of the present invention, it ispossible to prevent damage of the semiconductor substrate since theapplication step does not exist, and at the same time there is littlechance of bubbles entering between the semiconductor substrate and theadhesive tape during reapplication.

[0271] According to another feature of the present invention, the backgrind step can be conducted after the singularization step is completed.With this sequence, fragments caused at the edge portion of thesemiconductor element in the singularization step can be removed in theback grind step. Thus, the strength of the semiconductor element isincreased.

[0272] According to another feature of the present invention, it ispossible to prevent bubbles from remaining between the semiconductorsubstrate and the film because the annular member moves individually,gradually pressing the film to the semiconductor substrate from thecenter outward. Therefore, the steps that follow can be conductedsmoothly and damage to the semiconductor substrate due to the enteringof bubbles may be prevented.

[0273] According to another feature of the present invention, it ispossible to prevent bubbles from remaining between the semiconductorsubstrate and the first adhesive tape, and the state in which thesemiconductor substrate is securely held by the semiconductor substratejig is maintained in the back grind step. Thus, the back grind step canbe conducted smoothly.

[0274] According to another feature of the present invention,ultraviolet rays can be irradiated through the semiconductor substratejig to the adhesive having the property of ultraviolet curing, and thewidely used ultraviolet curing type adhesives are used in thesemiconductor manufacturing, thus the manufacturing cost of thesemiconductor element are reduced.

[0275] According to another feature of the present invention, even witha thinned semiconductor substrate, the warping of the semiconductorsubstrate can be reliably prevented since the semiconductor substrate isheld by either the first jig or the second jig.

[0276] According to another feature of the present invention, thesemiconductor substrate jig according to the present invention is used,and thus the warping of the semiconductor is prevented when transportingthe semiconductor substrate between the first jig and the second jig,and therefore, the breakage of the semiconductor substrate can beprevented thus enabling the subsequent semiconductor manufacturing stepsto be smoothly conducted.

[0277] While the preferred embodiments of the present invention has beendescribed, it is to be understood that the present invention is notlimited to these embodiments, and variations and modifications may bemade without departing from the scope of the present invention.

What is claimed is
 1. A method of manufacturing a semiconductor deviceusing a semiconductor substrate jig, comprising the steps of: fixing asemiconductor substrate flatly to said semiconductor substrate jig so asto prevent warps from occurring in said semiconductor substrate; anddicing said semiconductor substrate into a plurality of semiconductorelements while fixed to said semiconductor substrate jig.
 2. A method ofmanufacturing a semiconductor device using a semiconductor substrate jigcomprising the steps of: fixing a semiconductor substrate flatly to saidsemiconductor substrate jig so as to prevent warps from occurring insaid semiconductor substrate; and back grinding said semiconductorsubstrate while attached to said semiconductor substrate jig.
 3. Asemiconductor substrate jig used for arranging a film on one surface ofa semiconductor substrate, wherein said semiconductor substrate jigcomprises: a frame; and an expandable member arranged within said frame,and increasing or decreasing volume while deforming a shape of saidexpandable member by being supplied with fluid therein; wherein saidshape is deformed so that said film arranged between said semiconductorsubstrate and said expandable member is pressed against saidsemiconductor substrate as contacting portion of the expandable memberto the film is enlarged outwardly from the center of said film as saidvolume increases.
 4. A semiconductor substrate jig as claimed in claim3, wherein a movable plate is provided inside said expandable member,and is movable to a position contacting said expandable member when saidexpandable member presses substantially an entire surface of said filmagainst said semiconductor substrate, wherein a state in which saidexpandable member presses said substantially entire surface of said filmto said semiconductor substrate is maintained by said movable plate. 5.A semiconductor substrate jig claimed in claim 4, wherein a suctionmechanism for suctioning said expandable member is provided in saidmovable plate.
 6. A method of manufacturing a semiconductor device usingthe semiconductor substrate jig claimed in claim 3, wherein said methodcomprises the steps of: attaching a circuit-forming surface of saidsemiconductor substrate to said semiconductor substrate jig using afirst adhesive tape as said film; back grinding a back surface of saidsemiconductor substrate while attached to said semiconductor substratejig; reapplying and fixing said semiconductor substrate to a secondsemiconductor substrate jig so as to expose said circuit-formingsurface; singularizing said semiconductor substrate fixed on said secondsemiconductor substrate jig into a plurality of semiconductor elementsby dicing; and picking up each of said singularized semiconductorelements from said second semiconductor substrate jig.
 7. A method ofmanufacturing a semiconductor device as claimed in claim 6, wherein thesemiconductor substrate jig claimed in claim 3 is used as said secondsemiconductor substrate jig.
 8. A method of manufacturing asemiconductor device using the semiconductor substrate jig claimed inclaim 3, wherein said method comprises the steps of: attaching acircuit-forming surface of said semiconductor substrate to saidsemiconductor substrate jig using a first adhesive tape as said film;back grinding a back surface of said semiconductor substrate whileattached to said semiconductor substrate jig; singularizing said backgrounded semiconductor substrate fixed on a second semiconductorsubstrate jig into a plurality of semiconductor elements by dicing;reapplying and fixing said one or more semiconductor elements on saidsecond semiconductor substrate jig to a second semiconductor substratejig so as to collectively expose said circuit-forming surfaces; andpicking up each of said singularized semiconductor elements from saidsecond semiconductor substrate jig.
 9. A method of manufacturing asemiconductor device using the semiconductor substrate jig claimed inclaim 3, wherein said method comprises the steps of: attaching acircuit-forming surface of said semiconductor substrate to saidsemiconductor substrate jig using a first adhesive tape as said film;back grinding a back surface of said semiconductor substrate whileattached to said semiconductor substrate jig; singularizing said backgrounded semiconductor substrate fixed to second semiconductor substratejig into a plurality of semiconductor elements by dicing; and picking upeach of said singularized semiconductor elements from said secondsemiconductor substrate jig and turning said picked up one or moresemiconductor elements upside down.
 10. A method of manufacturing asemiconductor device using the semiconductor substrate jig claimed inclaim 3, wherein said method comprises the steps of: attaching acircuit-forming surface of said semiconductor substrate to saidsemiconductor substrate jig using a first adhesive tape as said film;singularizing said semiconductor substrate fixed on said semiconductorsubstrate jig into a plurality of semiconductor elements by dicing; backgrinding collectively back surfaces of said one or more semiconductorselement attached to said semiconductor substrate jig; reapplying andfixing said one or more semiconductor elements collectively to a secondsemiconductor substrate jig so as to expose said circuit-formingsurfaces; and picking up each of said semiconductor elements from saidsecond semiconductor substrate jig.
 11. A method of manufacturing asemiconductor device using the semiconductor substrate jig claimed inclaim 3, wherein said method comprises the steps of: attaching acircuit-forming surface of said semiconductor substrate to saidsemiconductor substrate jig using a first adhesive tape as said film;singularizing said semiconductor substrate fixed on said semiconductorsubstrate jig into a plurality of semiconductor elements by dicing; backgrinding back surfaces of said one or more singularized semiconductorelements attached to said semiconductor substrate jig; and picking upeach of said singularized semiconductor elements from said semiconductorsubstrate jig and turning said picked up one or more semiconductorelement upside down.
 12. A semiconductor substrate jig used forarranging a film on a semiconductor substrate, wherein saidsemiconductor substrate jig comprises: a frame with a bottom; a set ofplural annular members arranged concentrically within said frame andconstructed so as to be individually movable in a directionperpendicular to said semiconductor substrate, heights of said annularmembers in said direction perpendicular to said semiconductor substrategradually increases from an outer circumference toward an innercircumference; a biasing member for biasing each of said annular memberstoward said bottom of said frame; and an operating member contactingsaid annular members by operating movement in said frame and providedfor biasing in a direction separating said annular members from saidbottom of said frame, against bias force of said biasing member; whereineach of said annular members moves so as to gradually press and movesaid film arranged between said semiconductor substrate and said set ofannular members toward said semiconductor substrate from center outwardwith said operating movement of said operating member.
 13. A method ofmanufacturing a semiconductor device using the semiconductor substratejig claimed in claim 12, wherein said method comprises the steps of:attaching a circuit-forming surface of said semiconductor substrate tosaid semiconductor substrate jig using a first adhesive tape as saidfilm; back grinding a back surface of said semiconductor substrate whileattached to said semiconductor substrate jig; die attach mounting forarranging die attach material to said back surface of said semiconductorsubstrate; reapplying and fixing said semiconductor substrate on asecond semiconductor substrate jig and exposing said circuit-formingsurface; singularizing said semiconductor substrate fixed on said secondsemiconductor substrate jig into a plurality of semiconductor elementsby dicing; and picking up said singularized semiconductor elements fromsaid second semiconductor substrate jig.
 14. A method of manufacturing asemiconductor device as claimed in claim 13, wherein said semiconductorsubstrate jig claimed in claim 12 is used as said second semiconductorsubstrate jig.
 15. A semiconductor substrate jig used in arranging afilm to a semiconductor substrate, wherein said semiconductor substratejig comprises: a frame; a porous member arranged within said frame so asto be opposite said film; and a vacuum hole formed in said frame andprovided for applying negative pressure to said porous member.
 16. Amethod of manufacturing a semiconductor substrate comprises the stepsof: attaching a circuit-forming surface of said semiconductor substrateto a semiconductor substrate jig that transmits light using adouble-sided tape applied with adhesives having ultraviolet curingproperties on both sides; back grinding a back surface of saidsemiconductor substrate while attached to said semiconductor substratejig; irradiating ultraviolet rays to said adhesives having saidultraviolet curing properties through said semiconductor substrate;reapplying for arranging die attach film to said back surface of saidsemiconductor substrate, reapplying and fixing said semiconductorsubstrate to a second semiconductor substrate jig, thus exposing saidcircuit-forming surface; singularizing said semiconductor substratefixed on said second semiconductor substrate jig into a plurality ofsemiconductor elements by dicing; and picking up said singularizedsemiconductor element from said second semiconductor substrate jig. 17.A semiconductor substrate jig comprising: a first jig having a firstsuction mechanism sucking said semiconductor substrate; and a second jighaving a second suction mechanism sucking said semiconductor substrate,said first and second jigs being removably constructed and independentlysucking said semiconductor substrate.
 18. A method of manufacturing asemiconductor device using the semiconductor substrate jig claimed inclaim 17, wherein said method comprises: a first step for suctioningsaid semiconductor substrate by said first jig and conducting a processfor semiconductor manufacturing; a second step for suctioning saidsemiconductor substrate by said second jig and conducting a process forsemiconductor manufacturing; a transportation step for installing saidsecond jig to said first jig, and transporting said semiconductorsubstrate while held by said first and second jigs.